👍 計畫對象：2027年應屆畢業之碩、博士生

👍 主修科系：主修半導體、電機、電子、光電、電信、物理、材料、化學、化工、機械、資工、資管、工工、工管、環工、土木、其他理工科系、人資、商管等相關領域

👍 徵才時程：

23. 申請日期：即日起 – 2026/10/31
23. 面談日期：即日起 – 2026/12/31
23. 履歷傳送門：投遞履歷請點我
23. 全職類職務說明 : (附上職務連結)

R&D (研究與發展組織)

1-1 Research and Development Engineer (R&D)

1-2 Design and Technology Platform Engineer (DTP)

1-3 Specialty Engineer (Specialty)

1-4 Advanced Packaging Technology Development Engineer (APTD)

Operations (營運組織)

2-1 Process Integration Engineer (PIE)

2-2 Process Engineer (PE)

2-3 Equipment Engineer (EQ)

2-4 Intelligent Manufacturing Engineer (IMC/MFG)

2-5 Facility Engineer (FAC)

2-6 Product Engineer (PE)

2-7 Advanced Packaging Technology and Service Engineer (APTS)

2-8 Quality & Reliability Engineer (Q&R)

2-9 E-Beam Operation Engineer (EBO)

Corporate Business (策略暨支援組織)

3-1 Information Technology Engineer (IT)

3-2 Corporate Planning Organization (CPO)

3-3 Materials Management (MM)

3-4 Human Resources (HR)